Thermal Performance of Cu Electroplated GaN/AlGaN High-Electron-Mobility Transistors with Various-Thickness Si Substrates

نویسندگان

چکیده

Thermal dissipation is an important issue for power devices. In this work, the impact of thermal effects on performance Cu electroplated GaN-based high-electron-mobility transistors (HEMTs) are considered. Electrical, thermometry and micro-Raman characterization techniques were used to correlate improved heat device GaN HEMTs with different thicknesses Si substrate (50, 100, 150 μm), without additional layer. (≤50 μm) demonstrate enhanced on/off current ratio compared bare by a factor ~400 (from 9.61 × 105 4.03 108). Of particular importance, surface temperature measurements reveal much lower channel thinner HEMT devices samples those without.

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ژورنال

عنوان ژورنال: Electronics

سال: 2023

ISSN: ['2079-9292']

DOI: https://doi.org/10.3390/electronics12092033